Boschman Advanced Packaging Technology

About Boschman Advanced Packaging Technology

Boschman Advanced Packaging Technology ontwikkelt en produceert molding- en sinter-systemen voor de halfgeleiderverwerkingsindustrie, met focus op Mems & Sensors, Smartcards en Power-toepassingen.

Keywords

• Ag Sintering
• Mems & Sensors
• Package Development
• Power Modules
• Transfer Molding

Address

• Headquarters

  Stenograaf 36921EX DuivenGelderland, Netherlands

Team by function

Based on 60 public job profiles as of 4 September 2026.

• Engineering / Software Development21
• Other / Unclassifiable7
• Skilled Trades / Technical7
• Operations6
• Finance / Accounting5
• Procurement / Supply Chain4
• Manufacturing / Production3
• IT / Infrastructure / Security2
• Administrative / Office1
• Executive / C-Suite1
• HR / People / Recruiting1
• Research / R&D1
• Sales1