Micronnect

About Micronnect

Micronnect is the service- and distributor company for bonding products to European users, such as companies, research institutes and universities. Since 1993, Micronnect serves 150 organizations in 21 countries. Micronnect offers bonding equipment, tools and materials.

Micronnect is offering users of bonding equipment, tools and materials. For distribution, the following brands are represented: • Die- and wire bonders — West.Bond (westbond.com) • Automated diebonders — Tresky GmbH (tresky.de) • Automated wirebonders — Kaijo-Shibuya • Bond Testers — XYZTEC (xyztec.com), West.Bond, JFP Microtechnic • Scriber and scriber/breaker — JFP Microtechnic (jfpmicrotechnic.com) • Flipchip equipment — JFP Microtechnic • Tools — DeWeyl (deweyl.com), SPT (smallprecisiontools.com) • Wire, ribbon, and Stampings — Ametek and Coining (ametek.com)

Micronnect offers deeply support for machines and their users: • After sales warranty support and training. • After warranty technical support and maintenance. • Service Level Agreement for regular calibration and maintenance. • Machine training for users. • Bonding knowledge and –technology. • Wirebond course in depth. • Process optimization training.

Micronnect is offering die- and wire-bonding service in our Laboratory.

Micronnect is growing to the “One Stop Shop” for electronic packaging users. This results in advice, technological products (equipment, tools and materials) and service (maintenance, training and process optimization).

Keywords

• Electronic Packaging
• Equipment Maintenance
• Optimization Production Processes
• Semi-Conductor And Sensor Assembly

Address

• Headquarters

  Van Dijklaan 75581WG WaalreNoord-Brabant, Netherlands

Team by function

Based on 4 public job profiles as of 3 September 2026.

• Administrative / Office1
• Consulting / Advisory1
• Engineering / Software Development1
• Operations1